MODEL OF THE TECHNOLOGICAL PROCESS OF WEDGE BONDING BASED ON FEK DELVOTEC 6400 IN THE PRODUCTION OF HYBRID ELECTRONIC MODULES

Abstract

Modern development of microelectronics and hybrid electronic modules is characterized by continuously increasing requirements for the accuracy, reliability, and stability of interconnections in the manufacturing process of electronic components. One of the most widely used technologies for forming electrical contacts is thin aluminum wire wedge bonding, which ensures high connection quality and the possibility of manufacturing process automation.

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